Six Sigma: Hermeticity Testing (Fine and Gross Leak) is used to determine the 1] H. Greenhouse, Hermeticity of Electronic Packages (William Andrew. As early as the s, SCHOTT’s Business Unit Electronic Packaging .. glass seal, for instance, hermeticity or seal strength, do not change as a result of. Electronic packaging is the design and production of enclosures for electronic devices ranging . Burn-in · Temperature cycling · Thermal shock · Solderability · Autoclave; Visual inspection; Hermeticity/moisture resistance.
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Examples are integrated circuit chips in ceramic Dual In-line Package form, or complex hybrid assemblies of chip components on a ceramic base plate. Quantities tend to be small; sometimes only one unit of a custom design is required.
This method is used mostly in very large electrical equipment such as utility transformers, to increase breakdown voltage. See Conformal coatingParylene. The design of these products depends on the production method and require careful consideration of dimensions and tolerances and tooling design.
From Wikipedia, the free encyclopedia. Another use is to protect deep-submergence items such as sonar transducers from collapsing under extreme pressure, by filling all voids. This also excludes dirt and conductive contaminants such as impure water from sensitive areas. This makes them part of the universe of electronic packaging.
Vacuum potting works best with resins that cure by polymerization, rather than solvent evaporation. Electronic packaging relies on mechanical engineering principles such as dynamics, stress analysis, heat transfer and fluid mechanics. In these, the individual diodes are mounted in an array that allows the device to produce a greater amount of luminous flux with greater ability to dissipate the resulting heat in an overall smaller package than can be accomplished by mounting LEDs, even surface mount types, individually on a circuit board.
Examples are injection molding, transfer molding, vacuum forming, and die cutting. An electronics assembly consists of component devices, circuit electronci assemblies CCAsconnectors, cables and components such as pacckages, power supplies, relays, switches, etc. In some products, such as computer accessory boards, they’re all the structure there is.
Liquid filling is sometimes used as electrknic alternative to potting or impregnation.
Some parts hermmiticity be manufactured by specialized processes such as plaster- and sand-casting of metal enclosures.
Please help improve this article by adding citations to reliable sources. Unsourced material may be challenged and removed. Curing can consist of polymerizing the internal resin or evaporating the solvent, which leaves an insulating dielectric material between different voltage components. These requirements extend beyond and interact with the electrical design.
Electronic packaging
Conformal coating is a thin insulating coating applied by various methods. Product safety standards may dictate packaes features of a consumer product, for example, external pacakges temperature or grounding of exposed metal parts.
It provides mechanical and chemical protection of delicate components. Hermetic metal packaging began life in the vacuum tube industry, where a totally leak-proof housing was essential to operation. Formally called “encapsulation”, potting consists hermiticiyy immersing the part or assembly in a liquid resin, then curing it. High-reliability equipment often must survive drop tests, loose cargo vibration, secured cargo vibration, extreme temperatures, humidity, water immersion or spray, rain, sunlight UV, IR and visible lightsalt spray, explosive shock, and many more.
Potting can be done in a pre-molded potting shell, or directly in a mold.
It’s usually a dielectric fluid, chosen for chemical compatibility with the other materials present. This type of packaging can also be divided into two main types: Packaging for aerospace, marine, or military systems imposes different types of design criteria. The pressure above the fluid is lowered to a full vacuum.
Articles needing additional references from December All articles needing additional references. Punched and formed sheet metal is one of the oldest types of electronic packaging. The main application of vacuum impregnation porosity sealing is in boosting the dielectric strength of transformers, solenoids, lamination stacks or coils, and some high voltage components. In the design of electronic products, electronic packaging engineers perform analyses to estimate packzges things as maximum temperatures for components, structural resonant frequencies, and dynamic stresses and deflections under worst-case environments.
After the vacuum is released, the fluid flows into the part.
Electronic packaging – Wikipedia
Printed circuits are primarily a technology for connecting components together, but they also provide mechanical structure. Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer.
Molded plastic cases and structural parts can be made by a variety of methods, offering tradeoffs in piece part cost, tooling cost, mechanical and electrical properties, and ease of assembly. Today, glass-seal packages are used mostly in critical components and assemblies for aerospace use, where leakage must be prevented even paxkages extreme changes in temperature, pressure, and humidity.
The tool of choice is a numerically controlled vertical milling machine, with automatic translation of computer-aided design CAD or to toolpath command files. This page was last edited on 31 Decemberat