JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR J-STDE, Dec This document identifies the classification level of nonhermetic solid-state surface mount Filter by document type. Reflow Profiles (per Jedec J-STDD.1). Profile Feature. Sn-Pb Eutectic Assembly. Pb-Free Assembly. Preheat/Soak. Temperature Min (Tsmin). °C. JEDEC / JEITA Joint Meeting #19 in Kyoto, Japan, September Steve Martell (Sonoscan) J-STDE. – J-STDE Officially Published December . stating that the document only covers wire bond packages was proposed . types of packages and Discussed at January Enrico e-mail – IPC question.
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Containing full color photographs, this specification sets the requirements for the use of ENIG as a surface finish for printed boards.
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Components such as thin fine-pitch jwdec and ball grid arrays could be damaged during SMT reflow when moisture fike inside the component expands.
It is not the typf of this standard to exclude any acceptable flux or soldering material; however, these materials must produce the desired electrical and metallurgical interconnection. Soldering flux materials include the fjle Denne revision har farvebilleder og illustrationer — hvoraf er ny eller opdaterede. Revision F has photos and illustrations of acceptability criteria — 86 of them new or updated.
Exposure to moisture and air contaminants, such as sulfur and chlorine, may negatively impact the useful life of the deposit. IPC-D S e indholdsfortegnelse her Establishes the general requirements for documentation necessary to fully describe end product printed boards, regardless of raw material, special fabrication requirements, layer count or end product usage. Part 3 is IPCB and includes procedures for modifying assemblies and accomplishing laminate and conductor repairs.
This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards.
In addition, the tables and appendices have been updated with the latest alloy information. This specification is a full-color document that is intended for use by the supplier or printed board fabricator, plating chemistry supplier, contract assembler or EMS facility and the original equipment manufacturer OEM. This “C” revision has been updated to address intentional additions to a solder alloy and impurities in the alloy. Retrieved from ” https: IPC – Specification for Base Materials for Rigid and Multilayer Printed Boards Se indholdsfortegnelse her This specification covers the requirements for base materials that are referred to as laminate or prepreg.
Moisture sensitivity level
These are to be used primarily for rigid and multilayer printed -jstd-020 for electrical and electronic circuits. This document contains 64 individual specification sheets that can be searched using keywords.
J-STD covers components to be processed at higher temperatures for lead-free and lower temperature Sn-Pb assemblies.
This section includes procedures common to rework, repair and modification. The series is built around the IPC se indholdsfortegnelse herGeneric Standard on Printed Board Design, the base document that covers all generic requirements for printed board design, regardless of materials.
The immersion tin Sn is a metallic finish deposited by a chemical displacement reaction that is applied directly to the basis metal of the printed board, which is copper. ipcc
This is known as the “popcorn” effect. It is an invaluable resource for use by suppliers, board fabricators, electronics manufacturing service EMS providers and original equipment manufacturers OEMs. Additionally, wherever possible statements were modified to make readability easier and to enhance understanding — all without eliminating any requirements. Part 1 General Requirements has also been updated for ease of use and provides important direction and guidelines for all procedures.
This standard describes test methods by which both the surface conductors and attachment lands and plated-through holes may be evaluated for solderability.
It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services EMS companies and original equipment manufacturers OEM. Major topics include flex attachment, board-in-board, part-on-part, both lead-free and tin-lead criteria, component orientation and soldering criteria for through hole, SMT, cleaning, marking, coating and laminate requirements.
This standard may be used for quality control and procurement purposes. Jj-std-020 can insert company specific procedures, or remove just the pages needed for a specific job to help keep the workbench clear.
The immersion gold protects the underlying nickel from oxidation or passivation over its intended life. IAg is a thin immersion deposit over copper. Three white papers are included to provide guidance on key topics discussed in the Standard. It may also be used when press fit connections are employed and for zero insertion force ZIF edge connectors. The objective of the solderability test methods described in this standard is to determine the ability filf printed board surface conductors, attachment lands, and plated-through holes to wet easily with solder and to withstand the rigors of the printed board assembly processes.